ADVANTUSE Koch Chemie Polish Set Pads (2024) 25 mm Height (3 x Pad 75 mm)

Heavy cut foam pad: the abrasive sponge to eliminate heavy weathering and deep scratches thanks to the Heavy Cut. The low height of 25 mm creates lower torsional forces, very good handling and maximum stability. Fine foam pad: the medium-hard sanding sponge for removing weathering and medium-strong scratches thanks to the fine cut. The low height of 25 mm creates lower torsional forces, very good handling and maximum stability. Micro Cut Soft Foam Pad: The special premium sponge for removing light scratches and holograms. The low height of 25 mm creates lower torsional forces, very good handling and maximum stability. The new design (25 mm height) of the pads ensures more direct handling and reduced torsional forces. KochChemie polishing sponges are individually packaged in a cardboard box which is also colour coded