Aluminum Heat Sink Heatsink Module Cooler Fin for High Power Transistor Semiconductor Devices 3.93"(L) x 3.93"(W) 0.7"(H) /100mm(L) 100mm(W) 18mm(H)

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Aluminum Heat Sink Heatsink Module Cooler Fin for High Power Transistor Semiconductor Devices 3.93"(L) x 3.93"(W) 0.7"(H) /100mm(L) 100mm(W) 18mm(H)

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Amazon Function: Appearance design maximizes cooling in contact with the air. Material: Made of high density aluminum. Overall size: 100mm (L) x 100mm (W) x 18mm (H). Application: Computer, FET, IC, power amplifier, voltage regulator, MOSFET, SCR etc. Make sure the size and heat dissipation of the heat sink is appropriate for your component. The 16 pcs fins increase the sealing area and thus ensure better heat dissipation.

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Price

£ 6.45

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Description (1)

Function: Appearance design maximizes cooling in contact with the air. Material: Made of high density aluminum. Overall size: 100mm (L) x 100mm (W) x 18mm (H). Application: Computer, FET, IC, power amplifier, voltage regulator, MOSFET, SCR etc. Make sure the size and heat dissipation of the heat sink is appropriate for your component. The 16 pcs fins increase the sealing area and thus ensure better heat dissipation.