High Efficiency Heat Dissipation Equipped with an alloy metal cooling Surfaces and hollowed out design for enhanced Flows, stable and long lasting cooling effects even during extended use Powerful Semiconductor Cooling Features advanced semiconductor cooling technology that rapidly lowers your phone temperature to ice cool levels, eliminating lag and overheating during intense gaming Meeting with efficient heat dissipation Ergonomic Not Slip Design Fits comfortably on the back of 4.7 6.7 Inch phones with a grip friendly shape that avoids hand obstruction, while its anti slip structure ensures stability during intense gameplay Very Quiet operate Runs at a hiss quiet ≤25dB noise Levels, making it ideal for live streaming, voice, and gaming without disruptive background noise Double Speed Cooling Modes two adjustable cooling power levels for customized temperature control, perfect for both casual use and heavy gaming, ensuring optimal in any scenario, Platforms: Not Machine Specific
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