ARCTIC TP-4: Premium Performance Thermal Pad, 100 x 0.5 mm

Arctic Tp-4 Thermal Paste 0.5 Mm. High Performance — Extremely Soft The silicone-based TP-4 combines high thermal conductivity with extremely low hardness and reliably compensates for manufacturing tolerances between chips.Safe Application Electrically insulating, non-adhesive, and easy to handle — for safe and reliable heat transfer.Minimizing Thermal Resistance The thinner the pad, the lower the thermal resistance.Depending on mounting pressure, the TP-4 can be compressed to up to 60% of its original thickness.Bridging Uneven Surfaces Adapts optimally to varying chip heights, air gaps, and uneven surfaces to ensure reliable contact.Available in Various Thicknesses and Sizes Available in 0.5 mm, 1.0 mm, and 1.5 mm thicknesses as well as multiple sizes.Can be individually cut to size if needed.Stackable Without Performance Loss Thanks to its low hardness and low interface resistance, multiple pads can be combined without affecting thermal transfer performance.Versatile Applications Ideal for RAM, chipsets, GPUs, consoles, laptops, and many other electronic components.Flexible, vibration-dampening, and easy to cut.ARCTIC TP-4 Premium Performance Thermal Pad.Type:Thermal pad, Density:3.4 g/cm³, Product colour:Grey.Width:100 mm, Depth:100 mm, Height:0.5 mm.Quantity per pack:1 pc(s), Package width:115 mm, Package depth:120 mm.Country of origin:China. tradeinn Techinn

HIGH-PERFORMANCE THERMAL CONDUCTIVITY WITH TP-4:Ultra-soft silicone-based pad outperforms many high-end alternatives, ensuring excellent heat transfer even across uneven chip surfaces. OPTIMAL COMPRESSION FOR LOWER THERMAL RESISTANCE:Highly compressible material (e.g. 0.5 mm to 0.3 mm) minimizes thermal resistance and compensates height differences up to 40%. PERFECT GAP FILLING PERFORMANCE:Adapts seamlessly to uneven surfaces and air gaps, providing reliable contact without stressing sensitive components. VERSATILE APPLICATION ACROSS DEVICES:Ideal for RAM, GPUs, laptops, consoles, M.2 SSDs, and various electronic components requiring efficient thermal management. SAFE AND USER-FRIENDLY DESIGN:Electrically insulating, non-adhesive, and vibration-dampening for secure handling and long-term reliability.