Asus Prime B860-plus Csm Motherboard. Build the future with the ASUS Prime B860-PLUS CSM motherboard. Designed for upcoming Intel Core Ultra (Series 2) processors on the LGA 1851 socket, this ATX board offers robust stability and performance. Experience blazing-fast DDR5 memory up to 8666 MHz across four DIMM slots, alongside speedy M.2 storage for reduced loading times. Its comprehensive cooling and ATX form factor ensure peak performance. The CSM designation signifies 36-month supply longevity and management tools for businesses. Enjoy 7.1 HD audio and a 2.5 Gb Ethernet port for wired connectivity. Prime B860-PLUS-CSM ASUS PRIME series motherboards are expertly engineered to unleash the full potential of the latest Intel® Core™ Ultra Processors (Series 2).Boasting a robust power design, comprehensive cooling solutions and intelligent tuning options, the PRIME B860-PLUS-CSM motherboard provides users and PC DIY builders with a range of performance optimizations via intuitive software and firmware features.It´s designed to be Advanced AI PC-ready, offering the power and connectivity needed for demanding AI applications.ASUS PRIME B860-PLUS-CSM.Processor manufacturer:Intel, Processor socket:LGA 1851 (Socket V1), Compatible processor series:Intel Core Ultra (Series 2).Supported memory types:DDR5-SDRAM, Maximum internal memory:256 GB, Memory slots type:DIMM.Supported storage drive interfaces:M.2, SATA III, Supported storage drive types:HDD & SSD, RAID levels:0, 1, 5, 10.Ethernet interface type:2.5 Gigabit Ethernet.Component for:PC, Motherboard form factor:ATX, Motherboard chipset family:Intel. tradeinn Techinn
AmazonReady for advanced AI PCs: designed for the future of AI computing, with the power and connectivity needed for demanding AI applications Intel LGA 1851 Socket: Supports Intel Core Ultra processors (Series 2) ASUS CSM Program: A stable motherboard supply, end-of-life notifications and IT software for business motherboards ASUS Control Center Express: Integrated IT monitoring and management software that simplifies enterprise-level system management OPTIMIZED THERMAL DESIGN: Solid heatsinks with integrated I O cover, highly conductive thermal pads
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