1. Improved version 2024, 40mm anodized aluminum heat sinks, flatter base plate and thick enough base material. Smooth surface without scratches and burrs. 2.Dimension: 1.57"x1.57"x0.79" (L*W*T) 40mmx40mmx20mm. 3. Unit weight: 1.45 oz / 41 gram per piece; Base Board thicknesses: 4.2mm/ 0.17inch; Fin thicknesses: 1.3mm/ 0.05inch; Fin Spacing: 2.52mm/ 0.1inch 4. This 40mm heatsink kit is suitable for cooling applications such as 3D printer stepper motor, NEMA17, TEC1-12706 Thermoelectric module, PC chipset, power IC, power electric device, LED light devices etc. For heat dissipation device, great function for heat dissipation reduces CPU and LAN. 5. Thermal conductive glue adhesive is the excellent partner to install the heat sink (gel is not included in the package)
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