BSFF Thermal Paste, 3.5g with Toolkit CPU Paste Compound Heatsink for IC/Processor/CPU/All Coolers, Carbon Based High Performance

SAFE APPLICATION: Metal-free and non-conductive design eliminates the risk of short circuits while adding extra protection for CPU and VGA cards. BETTER THAN LIQUID METAL: Made with carbon microparticles, this thermal paste provides excellent thermal conductivity, helping transfer heat away from CPU/GPU quickly and efficiently. HIGH DURABILITY: The advanced formula delivers excellent heat dissipation performance and stable thermal management, helping maintain reliable system performance during demanding workloads. EXCELLENT PERFORMANCE: Unlike metal and silicon-based thermal conductive adhesives, BSFF thermal paste maintains consistent performance over time. Once applied correctly, it provides reliable thermal transfer for long-term use. EASY TO APPLY: Designed with an ideal consistency, the thermal paste spreads smoothly and evenly. The included toolkit helps with precise application, making it simple for both beginners and experienced users.