Perfect Fit for BGA Components – 35mm x 35mm square nozzle optimised for Ball Grid Array (BGA) soldering and desoldering work. High Precision Airflow Control – Directs heat precisely where needed, reducing risk of damage to nearby components. Compatible with Duratool SMD Rework Stations – Engineered for seamless integration with Duratool hot air rework systems. Durable Build for Repeated Use – Made from high-quality materials to withstand frequent high-temperature operation. Essential for PCB Repairs & Rework – Ideal for electronics technicians and hobbyists handling modern SMD packages.
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