EC360® Glue 2W/mK Thermal (30g)
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ADHESION: Extra strong adhesion. Also suitable for heavy heatsinks. VERY HIGH THERMAL CONDUCTIVITY: At 2 W/mK it conducts heat up to 70 x better than EASY INSTALLATION: Apply a drop of glue, attach a heatsink and wait for the glue to dry. SAFE HANDLING: Electrically insulating and non-capacitive. No risk of short-circuiting. SIZE: 30g. Perfect for use with memory chips, North bridge chips and electronic components.
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Amazon
ADHESION: Extra strong adhesion. Also suitable for heavy heatsinks. VERY HIGH THERMAL CONDUCTIVITY: At 2 W/mK it conducts heat up to 70 x better than EASY INSTALLATION: Apply a drop of glue, attach a heatsink and wait for the glue to dry. SAFE HANDLING: Electrically insulating and non-capacitive. No risk of short-circuiting. SIZE: 30g. Perfect for use with memory chips, North bridge chips and electronic components.
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Description
(1)
ADHESION: Extra strong adhesion. Also suitable for heavy heatsinks. VERY HIGH THERMAL CONDUCTIVITY: At 2 W/mK it conducts heat up to 70 x better than EASY INSTALLATION: Apply a drop of glue, attach a heatsink and wait for the glue to dry. SAFE HANDLING: Electrically insulating and non-capacitive. No risk of short-circuiting. SIZE: 30g. Perfect for use with memory chips, North bridge chips and electronic components.
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