EC360® Gold 14.5W/mK Thermal Pad (50 x 50 1.0 mm)
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Description
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VERY HIGH THERMAL CONDUCTIVITY: EC360 GOLD are the intermediate variant of our high performance thermal pads. At 14.5 W/mK they conduct heat 521 x better than air. BRIDGE GAPS: The thermal pads are the perfect gap filler and seamlessly bridge surface irregularities. EASY INSTALLATION: They are self-adhesive and can be adjusted at any time, which makes them suitable for beginners. SAFE HANDLING: Electrically insulating and non-capacitive. No risk of short-circuiting. SIZE: 50 x 50 x 1.0 mm. Perfect for use with processors, memory chips and electronic components. Easy to cut, e.g. with scissors.
Description
(1)
VERY HIGH THERMAL CONDUCTIVITY: EC360 GOLD are the intermediate variant of our high performance thermal pads. At 14.5 W/mK they conduct heat 521 x better than air. BRIDGE GAPS: The thermal pads are the perfect gap filler and seamlessly bridge surface irregularities. EASY INSTALLATION: They are self-adhesive and can be adjusted at any time, which makes them suitable for beginners. SAFE HANDLING: Electrically insulating and non-capacitive. No risk of short-circuiting. SIZE: 50 x 50 x 1.0 mm. Perfect for use with processors, memory chips and electronic components. Easy to cut, e.g. with scissors.
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