EC360® Gold Soft 14,5W/mK Thermal Pad (100 x 100 0.5 mm, Soft)
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VERY HIGH THERMAL CONDUCTIVITY: EC360 GOLD are the intermediate variant of our high performance thermal pads. At 14.5 W/mK they conduct heat 521 x better than air. EXTRA SOFT: extra soft version of our thermal pads VERY HIGH THERMAL CONDUCTIVITY: EC360 GOLD are the intermediate variant of our high performance thermal pads. At 14.5 W/mK they conduct heat 521 x better than air. SAFE HANDLING: Electrically insulating and non-capacitive. No risk of short-circuiting. SIZE: 100 x 100 x 0.5 mm. Perfect for use with processors, memory chips and electronic components. Easy to cut, e.g. with scissors.
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Amazon
VERY HIGH THERMAL CONDUCTIVITY: EC360 GOLD are the intermediate variant of our high performance thermal pads. At 14.5 W/mK they conduct heat 521 x better than air. EXTRA SOFT: extra soft version of our thermal pads VERY HIGH THERMAL CONDUCTIVITY: EC360 GOLD are the intermediate variant of our high performance thermal pads. At 14.5 W/mK they conduct heat 521 x better than air. SAFE HANDLING: Electrically insulating and non-capacitive. No risk of short-circuiting. SIZE: 100 x 100 x 0.5 mm. Perfect for use with processors, memory chips and electronic components. Easy to cut, e.g. with scissors.
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VERY HIGH THERMAL CONDUCTIVITY: EC360 GOLD are the intermediate variant of our high performance thermal pads. At 14.5 W/mK they conduct heat 521 x better than air. EXTRA SOFT: extra soft version of our thermal pads VERY HIGH THERMAL CONDUCTIVITY: EC360 GOLD are the intermediate variant of our high performance thermal pads. At 14.5 W/mK they conduct heat 521 x better than air. SAFE HANDLING: Electrically insulating and non-capacitive. No risk of short-circuiting. SIZE: 100 x 100 x 0.5 mm. Perfect for use with processors, memory chips and electronic components. Easy to cut, e.g. with scissors.