EC360® NON SILICONE 5 W/mK Thermal Pad (100 x 100 1.0 mm)

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EC360® NON SILICONE 5 W/mK Thermal Pad (100 x 100 1.0 mm)

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Amazon GOOD THERMAL CONDUCTIVITY: EC360 NON SILICONE are the premium variant of our thermal pads. At 5.0 W/mK they conduct heat 180 x better than air. BRIDGE GAPS: The thermal pads are the perfect gap filler and seamlessly bridge surface irregularities. SILICONE FREE: The thermal pads are silicone-free and therefore leak no silicone oil. SAFE HANDLING: Electrically insulating and non-capacitive. No risk of short-circuiting. SIZE: 100 x 100 x 1.0 mm. Perfect for use with memory chips and electronic components. Easy to trim, for example with a scissor.

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£ 4.50

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Description (1)

GOOD THERMAL CONDUCTIVITY: EC360 NON SILICONE are the premium variant of our thermal pads. At 5.0 W/mK they conduct heat 180 x better than air. BRIDGE GAPS: The thermal pads are the perfect gap filler and seamlessly bridge surface irregularities. SILICONE FREE: The thermal pads are silicone-free and therefore leak no silicone oil. SAFE HANDLING: Electrically insulating and non-capacitive. No risk of short-circuiting. SIZE: 100 x 100 x 1.0 mm. Perfect for use with memory chips and electronic components. Easy to trim, for example with a scissor.