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ADHESION: Normal adhesion. Not suitable for heavy heatsinks. GOOD THERMAL CONDUCTIVITY: At 1.2 W/mK it conducts heat up to 42 x better than air. EASY INSTALLATION: Remove the protective layer, position the adhesive and attach a heatsink. SAFE HANDLING: Electrically insulating and non-capacitive. No risk of short-circuiting. Perfect for use with memory chips and electronic components. Easy to trim, for example with a scissor.