Endorfy Pactum 4 1.5 g Thermal Paste for the Processor EY0C003

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Amazon Sufficient for multiple applications.Compatible with copper, aluminum or nickel plated heatsink sockets Non-curing, non-conductive Advanced formula High thermal conductivity
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Description (1)

Sufficient for multiple applications.Compatible with copper, aluminum or nickel plated heatsink sockets Non-curing, non-conductive Advanced formula High thermal conductivity

Product specifications

Brand ENDORFY
EAN
  • 5903018666358
MPN
  • EY0C003

Price History

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