ENERMAX T50 AXE FSS 140 mm CPU Air Cooler All Black 230W TDP, 5 6mm Copper Heat Pipes, Guide Included, Pressure Differential Flow, 140mm Silent PWM Fan, Intel LGA 1700/1200 AMD AM5/AM4

Enermax Ets-t50 Axe Silent Edition Cpu Fan. The ETS -T50 AX Silent Edition is a high -performance CPU fan with a cooling capacity of up to 230W TDP and innovative technologies.The asymmetric design with five 6 mm heatpipes with the Heat Pipe Direct Touch technology guarantees rapid heat transfer and allows the installation of larger size RAM.The dissipator is equipped with a 14 cm Enermax fan with patented Twister Bearing technology.Air flow optimization Design Differentíal FLW Design increases air flow by up to +15%.The air will be guided through conical tunnels to accelerate its flow.Due to the fastest passage of cold air -heat will be removed faster.Vortex Generator Flow (VGF) Patent technology Vortex generators are applied in the aviation industry by conducting the air current as close as possible along the wings of the plane.During the development of the dissipator -Enermax engineers recognized the potential of this technology to optimize the air flow inside the heat dissipator:small spoilers in the fins -the so -called Vortex Generators -Conduce the air along the Heat Pipes.Much more fresh air can be transferred in the back of the Heat Pipes guaranteeing better cooling.Heat Pipe Direct Touch (HDT) with the patented technology Heat Pipe Direct Touch -The Heat Pipe is directly supported by the CPU.The advantage is the fastest heat transfer without any addition resistance.Asymmetric design of the Heat Pipe the asymmetric design of the Heat Pipe creates addition space to prevent the fan from blocking the RAM modules of larger size.Enermax High Pressure The ETS -T50 AX Silent Edition is equipped with a 14 cm high pressure fan designed for use in CPU dissipators.The patented Twister Bearing technology guarantees a soft function and a long shelf life of up to 160,000 MTBF hours.The 9 high pressure blades revolve to 500 1.,000 rpm to ensure an ultra silent function.Thermoconducting layer The thermoconducting layer is a protective coating that prevents oxidation without compromising heat transfer.Air diverter The equipped air diverter offers the user the possibility of directing the air flow in the desired direction.This allows the possibility of creating the perfect air flow in the box according to the needs of the system.TECHNICAL SPECIFICATION PANORAMA General ETS -T50A -FSS Zócalos compatible with Intel® LGA 1200 -775 -115x -1366 -2011 (-3) Square ILM -2066 Tomas compatible with AMD® FM1 -FM2 (+) -AM2 (+) -AM3 In 160mm Material Copper tubes for heating -aluminum hot springs 5x heat tubes Ø 6mm Hot immersion Black TCC Black fan model High pressure palette fan model PWM LED hm LED -TWINTER TRECING TRIP x 140 x 25mm Fan speed 500 -1.000 RPM Nominal voltage 12V 4 PWM connector 4 -plugs Quantity 1 Noise level 13 -22db (A) air flow 50.59 -55.45m3 -H air flow 29.78-94.21CFM Static pressure 0 -57 -2 -13MM -H2O Included in the Air Cooler supply volume -14 cm high pressure PWM ventilator -universal assembly kit for Intel® and AMD® sockets -Dow -Corning® Thermal Glass (TC -5121) -Cheyon -Sparcer -Installation guide.ETS Distributor information -T50A -FSS Product dimensions 144 -2 x 109 -5 x 160 mm Product weight 1.39kg Dimensions of the product box 220 x 175 x 130 mm Gross weight of the product box -Dimensions of the MAIN BOX 460 x 370 x 295mm Gross weight of the main box 12.5kg pieces of the main box 8 code EAN 4713157723376. tradeinn Techinn

☑️Pressure differential flow design – increases airflow up to +15% ☑️With the patented Heat Pipe Direct Touch technology, the heatpipes lie directly on the CPU. The advantage over a base plate is faster heat transfer without additional resistance. ☑️The 14cm ENERMAX fan with patented Twister BearingTM technology ensures efficient and permanently quiet cooling and long service life with up to 160,000 hours MTBF. ☑️Patented Air Guide with rotatable grill for preferred airflow direction adjustment directly toward the rear case fan area ☑️Asymmetric heat pipe design allows extra space for ideal RAM compatibility ☑️Unique air path creating high VEF (Vacuum Effect) to optimize the airflow ☑️Patented VGF (Vortex Generation Flow) to increase air convection around the heat pipe