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【PLA Refill Filament and Upgraded HIPS eSpool+ 2.0 Bundle】eSUN PLA refill kit, improved based on ordinary PLA, not only retains the environmental-friendly characteristics, but also add special materials to strengthen its fluidity and fast printing performance. 【Tangle Free & Simple Assembly】Neatly‑wound refill spool‑less filament with no overlaps or tangles to avoid print failures. Works seamlessly with upgraded eSpool+ 2.0 for quick, flexible disassembly and convenient filament swapping. 【Easy to Print】Compared with ordinary PLA filament, eSUN PLA refill kit has higher precision, no warping, less brittle and not easy to break. And it melts well, feeds smoothly and constantly without clogging the nozzle or extruder, thus assuring high printing successful rate and better forming effect. 【High Compatibility】eSUN PLA refill kit can directly fit in Bambu Lab AMS, and with excellent speedy printing performance, it is compatible with most mainstream high speed printers, such as such as AnkerMake M5, Bambu Lab X1/ P1P, K1/K1 MAX , Flsun V400, Raise3D Pro3/ RMF500, etc. 【Vacuumed Sealed Packaging】eSUN filament comes in a sealed vacuum bag with a desiccant bag, easily keep your 3D printer filaments at an optimal storage condition and free from dust or dirt before opening the vacuumed sealed packaging.