for Honeywell PTM7950 Silicone Thermal Pad Gasket 8.5W/mK Heat Dissipation Patch Replacement Lightweight Laptop GPU CPU

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Amazon Material:It is small in size and light in weight, making it convenient for you to carry and store when not in use.Made of high-quality silicone material,the heat conductive pad is soft and durable,with a smooth surface and exquisite workmanship. Advanced Technology:Ultra high thermal conductivity phase change material (PCM),available in both pad and phase change sheet forms,aims to reduce the thermal anti of the interface,pass reliability testing,and maintain excellent performance. Reliable:It is a proprietary material that provides excellent reliability (via 150 ℃ baking for 1000 hours,T/C-B for 1000 cycles) and maintain low thermal impedance,make the PTM7950 series the best choice for high-performance integrated circuit equipment. Ease of Use: It is recommended to use clamping pressure and temperature to achieve a minimum adhesive line thickness for thermal interface materials, typically less than 1.5 mil (0.038 mm) for optimal performance. Product Usage: The heat dissipation pad is specially designed for CPUs, GPUs, graphics cards, GPUs, power supplies, computer hosts, laptops, and any heat dissipation modules you need. Use it to heat your laptop or computer and avoid overheating.

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£ 9.78
Description (1)

Material:It is small in size and light in weight, making it convenient for you to carry and store when not in use.Made of high-quality silicone material,the heat conductive pad is soft and durable,with a smooth surface and exquisite workmanship. Advanced Technology:Ultra high thermal conductivity phase change material (PCM),available in both pad and phase change sheet forms,aims to reduce the thermal anti of the interface,pass reliability testing,and maintain excellent performance. Reliable:It is a proprietary material that provides excellent reliability (via 150 ℃ baking for 1000 hours,T/C-B for 1000 cycles) and maintain low thermal impedance,make the PTM7950 series the best choice for high-performance integrated circuit equipment. Ease of Use: It is recommended to use clamping pressure and temperature to achieve a minimum adhesive line thickness for thermal interface materials, typically less than 1.5 mil (0.038 mm) for optimal performance. Product Usage: The heat dissipation pad is specially designed for CPUs, GPUs, graphics cards, GPUs, power supplies, computer hosts, laptops, and any heat dissipation modules you need. Use it to heat your laptop or computer and avoid overheating.


Product specifications

Brand GENERIC
EAN
  • 0777091005091
  • 0777091005107
  • 0777091005114

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