Material: The heat conductive pad is small in size and light in weight, making it convenient for you to carry and store when not in use. Made of high-quality silicone material, the heat conductive pad is soft and , with a smooth surface and exquisite workmanship. With good sealing effect, it can effectively reduce the leakage of liquid during use, and can be used for a long time during refrigerate Advanced Technology: Ultra high thermal conductivity phase change material (PCM), available in both pad and phase change sheet forms, aims to reduce the thermal resistance of the interface, pass reliability testing, and maintain excellent performance. Based on a new polymer PCM system, this material exhibits excellent interfacial wettability within a typical operating temperature range, resulting Product Usage: The heat dissipation pad is specially designed for CPUs, GPUs, graphics cards, GPUs, power supplies, computer hosts, laptops, and any heat dissipation modules you need. Use it to heat your laptop or computer and prevent overheating. Ease of Use: It is recommended to use clamping and temperature to achieve a minimum adhesive line thickness for thermal interface materials, typically less than 1.5 (0.038 mm) for optimal performance. Materials must undergo a phase transition temperature to exhibit their proper properties Reliable: The PTM7950 is a proprietary material that provides excellent reliability (via 150 ℃ baking for 1000 hours, T/C-B for 1000 cycles) and maintaining low thermal impedance, making the PTM7950 series the best choice for high-performance integrated circuit equipment.
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