4.Silent noise reduction design, the sound is small to be heard, decibels ≤ 25dB 3.Powerful turbo fan, silent cooling, 9-blade large angled fan blades for cooling 1.Breakthrough refrigeration technology, TEC temperature control chip, every part is , providing an upgrading experience ordinary radiators 2.Semiconductor superconducting refrigeration plate, refrigeration speed is 6 times faster, and TEC refrigeration area is expanded by 3 times Close fit, increased cooling speed, seamless fit to the phone, high thermal conductivity cooling for even heat dissipation 5. Compatible with 99% of mobile phones on the market, regardless of model. With a back clip, the back clip is more convenient to remove, does not affect the heat dissipation of the phone, and is compatible with more models
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