MG Chemicals 4902P Sn42Bi57Ag1 Low Temperature Solder Paste T3, LEAD FREE, NO CLEAN, 25 Gram Pneumatic Dispenser (Complete with Plunger & Dispensing Tip)
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Low temperature solder paste with no clean flux Melting Point: 138 °C [280 °F] The powder distribution complies with the J-STD-005 Type 3 (with 80% min. between 25-45 μm) particle sizes. Store refrigerated between 2–10 °C [35–50 °F] to minimize solvent evaporation, flux separation andchemical activity. Bring the paste to room temperature prior to use. RoHS compliant
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Low temperature solder paste with no clean flux Melting Point: 138 °C [280 °F] The powder distribution complies with the J-STD-005 Type 3 (with 80% min. between 25-45 μm) particle sizes. Store refrigerated between 2–10 °C [35–50 °F] to minimize solvent evaporation, flux separation andchemical activity. Bring the paste to room temperature prior to use. RoHS compliant
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Low temperature solder paste with no clean flux Melting Point: 138 °C [280 °F] The powder distribution complies with the J-STD-005 Type 3 (with 80% min. between 25-45 μm) particle sizes. Store refrigerated between 2–10 °C [35–50 °F] to minimize solvent evaporation, flux separation andchemical activity. Bring the paste to room temperature prior to use. RoHS compliant
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