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Thermal conductivity of 0.9 W/(m·K) Low coefficient of thermal expansion Bonds strongly to metal, plastic, glass and wood Room temperature curing Strong resistance to humidity, salt water, chemicals and corrosive gas
Thermal conductivity of 0.9 W/(m·K) Low coefficient of thermal expansion Bonds strongly to metal, plastic, glass and wood Room temperature curing Strong resistance to humidity, salt water, chemicals and corrosive gas