Minus Pad 8 (120 x 20 1.5 mm)

THERMAL CONDUCTIVE PAD - It effectively dissipates significant amounts of heat 8W/(m·K) thanks to its unique composition of Ceramic Silicone and Nano-Aluminum Oxide FLEXIBLE STRUCTURE - The thermal padding compensates for even the smallest gaps between components with its flexible structure and high heat conductivity USED IN VARIOUS SCENARIOS - It is utilized in situations where thermal paste cannot be applied, such as cases with large air gaps or uneven surfaces GREAT RESULTS - By filling small gaps with its flexible and highly conductive structure, the Thermal Pad effectively dissipates heat between components THERMAL CONDUCTIVITY - With a highly conductive and versatile nature, it is suitable for a wide range of configurations with basic to high requirements