EFFICIENT HEAT DISSIPATION: Features 6.0 W/mK thermal conductivity to effectively bridge gaps between heat sources and sinks, preventing hardware overheating and ensuring stable performance. SOFT & FLEXIBLE SILICONE: Constructed from heavy-duty thermal silica gel, these pads are highly compressible and elastic. The self-adhesive surface ensures secure contact without sliding. MULTIPURPOSE COOLING SOLUTION: Ideal for SSDs, laptop CPUs, GPUs, power LEDs, and game consoles. Compatible with various IC chipsets and control boards to maintain optimal temperatures. CUSTOMISABLE & EASY INSTALLATION: Each 20mm x 67mm pad can be easily trimmed to specific sizes with scissors. VERSATILE VALUE PACK: Includes 30 pieces in three thicknesses (10x 0.5mm, 10x 1.0mm, 10x 1.5mm).
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