Reballing Station, BGA Station Solder Rework Kit Soldering Station+Stencils+Balls
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Aluminum alloy structure, the structure is light and The upper cover has a groove which is convenient for removal of excess tin balls. One reballing station can be used with different stencils. Can correspond to BGA of different sizes, maximum chip size is 50*50mm. BGA chip secedes steel stencils size is 90*90mm.
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61.77
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Description
Amazon
Aluminum alloy structure, the structure is light and The upper cover has a groove which is convenient for removal of excess tin balls. One reballing station can be used with different stencils. Can correspond to BGA of different sizes, maximum chip size is 50*50mm. BGA chip secedes steel stencils size is 90*90mm.
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Description
(1)
Aluminum alloy structure, the structure is light and The upper cover has a groove which is convenient for removal of excess tin balls. One reballing station can be used with different stencils. Can correspond to BGA of different sizes, maximum chip size is 50*50mm. BGA chip secedes steel stencils size is 90*90mm.
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