LIQUID METAL FOR MAXIMUM HEAT TRANSFER Conductonaut is designed for experienced users who need very high thermal performance. MADE FOR OVERCLOCKING AND HIGH-PERFORMANCE SYSTEMS Suitable for CPU and GPU applications with compatible contact surfaces. PRECISE APPLICATION WITH SUITABLE ACCESSORIES Supports controlled distribution of liquid metal during advanced cooling projects. OPTIMIZED FOR NICKEL-PLATED COPPER Intended for compatible cooler surfaces and direct heat-transfer applications. ELECTRICALLY CONDUCTIVE, SHORT-CIRCUIT RISK, NOT FOR ALUMINUM Apply only with care and avoid aluminum due to material incompatibility.
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