Thermal Grizzly Kryonaut combiné de dissipateurs thermiques 12,5 W/m·K 11,1 g

Thermal Grizzly Putty Basic 30g Thermal Paste. Upgrade your PC cooling with THERMAL GRIZZLY Putty Basic 30g, the smart, flexible alternative to thermal pads. This electrically non-conductive putty effortlessly fills gaps and compensates for height differences, making it ideal for GPUs, laptops, and more. Its high-viscosity, pliable consistency ensures easy application and perfect conformity when mounting heatsinks. Enjoy long-term stability without drying or cracking, guaranteeing reliable heat dissipation. A must-have for maintenance and upgrades, this 30g syringe offers a simple, effective solution for optimal thermal performance. THERMAL GRIZZLY Putty Basic 30g Thermal PasteCategory: ComponentsSubcategory: Maintenance--- Upgrade Your Cooling: The Smart Alternative to Thermal PadsElevate your system´s thermal management with the THERMAL GRIZZLY Putty Basic 30g. This innovative thermal putty is expertly engineered to provide a superior, user-friendly solution for cooling components where traditional thermal pads fall short. Say goodbye to the hassle of measuring, cutting, and stacking multiple thermal pads of different thicknesses. The Putty Basic simplifies the process, offering a versatile, one-stop solution for achieving optimal contact and heat transfer between your heatsink and critical components.TG Thermal Putty is an electrically non-conductive alternative to conventional thermal pads. As an easy-to-apply and flexible gap filler, it compensates for height differences and is therefore ideal as a replacement for thermal pads on graphics cards. Typically, several types of thermal pads of varying heights are used as standard, so when renewing the pads or converting the cooler to a GPU water cooler, several different pads are required. The Putty Basic offers a medium thermal conductivity, ensuring efficient heat dissipation for a wide range of applications. Key Benefits & Superior Features* Effortless Application: The putty´s highly viscous, yet pliable consistency makes application a breeze. Simply apply it directly to the component, and it will perfectly conform to the surface and fill any gaps when the heatsink is mounted, ensuring complete coverage without any guesswork.* Enhanced Safety: Engineered for peace of mind, the Putty Basic is electrically non-conductive. This crucial feature eliminates any risk of short circuits, allowing you to apply it confidently around sensitive electronic components without fear of damage.* Long-Term Stability and Reliability: Designed for durability, the THERMAL GRIZZLY Putty Basic maintains its consistency over long periods of use. It is formulated to resist drying out, bleeding, or cracking, ensuring stable thermal performance and a reliable cooling solution for the life of your components.* Ideal for GPU Maintenance and Upgrades: Whether you are performing routine maintenance, replacing old and inefficient thermal pads on your graphics card, or embarking on a custom water-cooling project, the 30g syringe provides ample material for multiple applications, making it a cost-effective and indispensable tool for any PC enthusiast or builder.---Attributes: Thermal pastesSpecifications:* Thermal Conductivity: Medium* Application: Ideal replacement for thermal pads, gap filler* Compatibility: GPUs (VRAM, VRM), Laptops, Game Consoles, Motherboard Chipsets* Consistency: High-viscosity putty* Electrical Conductivity: NoneContents:* Weight (Contents): 30 g. tradeinn Techinn

THERMAL PUTTY FOR VRAM, VRM AND PCB AREAS TG Putty Basic is made as a flexible replacement for classic thermal pads. VERY GOOD THERMAL CONDUCTIVITY FOR COMPONENT COOLING The kneadable material fills gaps and supports heat transfer to the cooler. FLEXIBLE GAP FILLER FROM 0.2 TO 3.0 MM Helps compensate height differences when replacing pads on graphics cards and PCBs. EASY APPLICATION FOR MODDING AND MAINTENANCE Useful for GPU water-block installation, cooler swaps and repair work. ELECTRICALLY NON-CONDUCTIVE FOR SAFER HANDLING Designed for component areas such as VRAM and VRM, not for direct die use.