Thermal Grizzly Minus Pad Basic 4 Pack Interface Pad, 120x20x3.0mm, Electrically Non Conductive, High Conductivity & Compressibility for SSDs, GPUs Electronics

Thermal Grizzly Minus Pad Basic 120x20x3.0 Mm Thermal Paste. Features:High-performance alternative to thermal paste:- With the Thermal Grizzly Minus Pad Basic, the Hamburg cooling specialist expands its product range with advanced thermal pads. Based on the predecessor Minus Pad 8, they have been further developed to significantly improve thermal conductivity.- The Minus Pad Basic is ideal for applications where thermal paste is difficult to apply or where a gap between the heat source and the heatsink needs to be bridged. It is therefore perfectly suited for use with memory chips or voltage converters. It is based on a silicone-containing carrier complex and aluminium oxide as a heat transfer medium, achieving a similar thermal conductivity to thermal paste.- The Minus Pad is available in various dimensions and thicknesses from 0.5 to 3 millimetres. Since it functions optimally even under minimal contact pressure and its thermal conductivity is hardly affected by thickness, the choice of thickness should only be based on the distance to be bridged.Specifications:Dimensions: - Length / Depth: 120 mm- Width: 20 mm- Height: 3 mmMaterials:- Materials: Aluminium oxide. tradeinn Techinn

THERMAL PAD FOR GPU, SSD AND COMPONENT COOLING Minus Pad Basic is made for reliable heat transfer between components and coolers. GOOD THERMAL CONDUCTIVITY FOR PC HARDWARE The material supports efficient cooling for VRAM, SSD controllers, chipsets and similar parts. FLEXIBLE PAD MATERIAL FOR EASY INSTALLATION Can compensate contact tolerances and supports clean handling during assembly. AVAILABLE IN PRACTICAL SIZES AND THICKNESSES This variant uses 4x 120x20x3.0 mm for targeted replacement or new cooling setups. NON-CURING AND ELECTRICALLY NON-CONDUCTIVE Designed for long-term stability and safer use on sensitive electronic components.