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THERMAL PUTTY FOR VRAM, VRM AND PCB AREAS TG Putty Advance is made as a flexible replacement for classic thermal pads. EXCELLENT THERMAL CONDUCTIVITY FOR COMPONENT COOLING The kneadable material fills gaps and supports heat transfer to the cooler. FLEXIBLE GAP FILLER FROM 0.2 TO 3.0 MM Helps compensate height differences when replacing pads on graphics cards and PCBs. EASY APPLICATION FOR MODDING AND MAINTENANCE Useful for GPU water-block installation, cooler swaps and repair work. ELECTRICALLY NON-CONDUCTIVE FOR SAFER HANDLING Designed for component areas such as VRAM and VRM, not for direct die use.