HIGH-DENSITY COPPER FINS - Designed to accommodate high air volume (Fin per Inch: 17). REFLOW SOLDERING - High-quality and high-temperature soldering at 482℉/250℃ ensures optimal thermal transfer with full strength on all connected area avoiding cracking and fail over time. OPTIMIZED HEAT DISPATCHING - Optimized for efficiently pulling heat away from the power-dissipating components thus achieving maximum heat dissipation at both low and high airflow operation. International products have separate terms, are sold from abroad and may differ from local products, including fit, age ratings, and language of product, labeling or instructions.
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