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This heatsink plaster is high thermal conductivity, low leakage and high temperature stability. Apply to 3d printer heatsink, CUP, LED, IC, GPU Chipset, PC Heatsink and all kinds of electronic component that need to be directly bonded firmly. The thermal adhesive is thermal properties, strong adhesion to most metals and non-metals, odorless, non-toxic, moisture-proof, non-swelling, non-corrosive to substrate. Quickly solidifies after exposure to air. Dry time: [25 °C] about 30min.