ADVANCED SEMICONDUCTOR PACKAGING FOR AI CHIPS: HBM Memory, Chiplet Integration, 2.5D and 3D Packaging, Hybrid Bonding, Thermal Design, Package Reliability

Prices from
19.44

Sponsored links

COMPARE ALL WEBSHOPS (2)

Description

ADVANCED SEMICONDUCTOR PACKAGING FOR AI CHIPS: HBM Memory, Chiplet Integration, 2.5D and 3D Packaging, Hybrid Bonding, Thermal Design, Package Reliability

Description Description
Product Specifications Product specifications
Related results Related results
Next
Previous

Compare webshops (2)

Sponsored links · Some shops pay us a fee

Sort by:

£ 19.44

£ 19.44

Description (0)

ADVANCED SEMICONDUCTOR PACKAGING FOR AI CHIPS: HBM Memory, Chiplet Integration, 2.5D and 3D Packaging, Hybrid Bonding, Thermal Design, Package Reliability

Product specifications

Brand Independently Published
EAN
  • 9798164137984

Independently Published

SEMICONDUCTOR Packaging ENGINEERING: Advanced Chiplets 3D Integration Thermal Management Interconnects Testing and Reliability

£ 9.52
Compare 2 stores 2 stores

Independently Published

Advanced Semiconductor Packaging Handbook: Chiplets, Heterogeneous Integration, 2.5D/3D Design, Manufacturing, Reliability, and Test

£ 74.80
Compare 2 stores 2 stores

Independently Published

Advanced Semiconductor Packaging Handbook: Chiplets, Heterogeneous Integration, 2.5D/3D Design, Manufacturing, Reliability, and Test

£ 97.25
Compare 2 stores 2 stores

Springer

Chiplet Design and Heterogeneous Integration Packaging

£ 126.45
Compare 2 stores 2 stores
Featured Choice
£ 19.44
To Shop