Advanced Semiconductor Packaging Handbook: Chiplets, Heterogeneous Integration, 2.5D/3D Design, Manufacturing, Reliability, and Test

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Pages: 518, Hardcover, Independently published

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Brand Independently Published
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  • 9798189969195

CRC Press

Materials for Advanced Semiconductor Packaging and Heterogeneous Integration

£ 130.00
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World Scientific Publishing Company

Co-design And Modelling For Advanced Integration Packaging: Manufacturing Reliability: 0 (Wspc Series In Packaging)

£ 104.17
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Springer

Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets Heterogeneous Integration

£ 109.99
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Springer

Chiplet Design and Heterogeneous Integration Packaging

£ 96.24
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