ADVANCED THERMAL MANAGEMENT FOR POWER SEMICONDUCTORS: Heat sink design packaging integration and reliability analysis

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Description (1)

Pages: 153, Paperback, Independently published

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Brand Independently Published
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  • 9798250306713

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Independently Published

POWER SEMICONDUCTOR DEVICES and PACKAGING: Wide Bandgap Materials Thermal Management High Voltage Reliability

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ADVANCED PACKAGING TECHNOLOGY FOR ELECTRONICS: thermal dissipation strategies and microassembly integration

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ADVANCED PACKAGING TECHNOLOGY FOR ELECTRONICS: thermal dissipation strategies and microassembly integration

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Cost Analysis Of Electronic Systems (Wspc Series In Advanced Integration And Packaging Book 1)

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