ASUS PRIME X670 P WIFI, an AMD Ryzen AM5 ATX motherboard with three M.2 slots, DDR5, USB 3.2 Gen 2x2 Type C, USB4 support, WiFi 6 and 2.5Gb Ethernet
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AMD Socket AM5 for AMD Ryzen 7000 Series Desktop Processors Upgraded Power Supply 12+2 DrMOS, 6-layer board, ProCool connectors, alloy coils and durable capacitors for stable power supply Ultra-fast connectivity: Wi-Fi 6, M.2 PCIe 5.0, Realtek 2.5 GB Ethernet, USB 3.2 Gen 2x2 Type-C, front panel USB 3.2 Gen 1 Type-C, USB4 header support ASUS OptiMem II: precise tracking and through-contacts, as well as optimisation of mass layers to maintain signal integrity for improved memory overclocking Comprehensive Cooling: Large VRM Heatsink, M.2 Heatsink, Passive Chipset Heatsink, Hybrid Fan Header and Fan Xpert 4 with AI Cooling II
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AMD Socket AM5 for AMD Ryzen 7000 Series Desktop Processors Upgraded Power Supply 12+2 DrMOS, 6-layer board, ProCool connectors, alloy coils and durable capacitors for stable power supply Ultra-fast connectivity: Wi-Fi 6, M.2 PCIe 5.0, Realtek 2.5 GB Ethernet, USB 3.2 Gen 2x2 Type-C, front panel USB 3.2 Gen 1 Type-C, USB4 header support ASUS OptiMem II: precise tracking and through-contacts, as well as optimisation of mass layers to maintain signal integrity for improved memory overclocking Comprehensive Cooling: Large VRM Heatsink, M.2 Heatsink, Passive Chipset Heatsink, Hybrid Fan Header and Fan Xpert 4 with AI Cooling II
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AMD Socket AM5 for AMD Ryzen 7000 Series Desktop Processors Upgraded Power Supply 12+2 DrMOS, 6-layer board, ProCool connectors, alloy coils and durable capacitors for stable power supply Ultra-fast connectivity: Wi-Fi 6, M.2 PCIe 5.0, Realtek 2.5 GB Ethernet, USB 3.2 Gen 2x2 Type-C, front panel USB 3.2 Gen 1 Type-C, USB4 header support ASUS OptiMem II: precise tracking and through-contacts, as well as optimisation of mass layers to maintain signal integrity for improved memory overclocking Comprehensive Cooling: Large VRM Heatsink, M.2 Heatsink, Passive Chipset Heatsink, Hybrid Fan Header and Fan Xpert 4 with AI Cooling II