EC360® Platinum Soft 16,6W/mK Thermal Pad (100 x 100 0,5 mm, Soft)
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EXCELLENT THERMAL CONDUCTIVITY: EC360 PLATINUM are the high-end variant of our high performance thermal pads. At 16.6 W/mK they conduct heat 597 x better than air. EXTRA SOFT: extra soft version of our thermal pads BRIDGE GAPS: The thermal pads are the perfect gap filler and seamlessly bridge surface irregularities. SAFE HANDLING: Electrically insulating and non-capacitive. No risk of short-circuiting. SIZE: 100 x 100 x 0.5 mm. Perfect for use with processors, memory chips and electronic components. Easy to cut, e.g. with scissors.
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Amazon
EXCELLENT THERMAL CONDUCTIVITY: EC360 PLATINUM are the high-end variant of our high performance thermal pads. At 16.6 W/mK they conduct heat 597 x better than air. EXTRA SOFT: extra soft version of our thermal pads BRIDGE GAPS: The thermal pads are the perfect gap filler and seamlessly bridge surface irregularities. SAFE HANDLING: Electrically insulating and non-capacitive. No risk of short-circuiting. SIZE: 100 x 100 x 0.5 mm. Perfect for use with processors, memory chips and electronic components. Easy to cut, e.g. with scissors.
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Description
(1)
EXCELLENT THERMAL CONDUCTIVITY: EC360 PLATINUM are the high-end variant of our high performance thermal pads. At 16.6 W/mK they conduct heat 597 x better than air. EXTRA SOFT: extra soft version of our thermal pads BRIDGE GAPS: The thermal pads are the perfect gap filler and seamlessly bridge surface irregularities. SAFE HANDLING: Electrically insulating and non-capacitive. No risk of short-circuiting. SIZE: 100 x 100 x 0.5 mm. Perfect for use with processors, memory chips and electronic components. Easy to cut, e.g. with scissors.
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