250 g roll of lead-free solder with a diameter of 1.50 mm for creating permanent solid solder joints Due to the silver content of 0.3%, the lead-free solder achieves increased electrical conductivity No-clean flux: Residue-free flux, which is increasingly used in electronics manufacturing. No cleaning of the soldering points required after soldering Causes a low smoke during the soldering process and is free from any halogens Composition: 0.3% silver, 0.7% copper, 96.5% tin. Flux content: 2.5%. Melting point 217°C
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