MASUNN Bga Ic Adhesive Removing Liquid Glue Epoxy Remover Cell Phone Cpu Chip Cleaner
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£ 22.12 | To Shop |
Description
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- It can help you soften & remove resinating / sealing glue of chip BGA IC of mobile phones easily. - It can quickly soften and loosen solidified resin adhesive such as epoxy, phenolics, acrylate, polyurethane, organosilicon etc.And it won't do harm to your circuit board and components. - This is a environment friendly item and it's very safe. Doesn't contain any Benzene Coderivative substances with cause leukaemia. 1. Pick an bigger size absorbent cotton than BGA IC with a tweezers and dip into the removing liquid. Then cover it evenly on BGA IC chip which in need of glue removing. 2. Place a plastic bag or film on the top and cover the PCB board.
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Description
(1)
- It can help you soften & remove resinating / sealing glue of chip BGA IC of mobile phones easily. - It can quickly soften and loosen solidified resin adhesive such as epoxy, phenolics, acrylate, polyurethane, organosilicon etc.And it won't do harm to your circuit board and components. - This is a environment friendly item and it's very safe. Doesn't contain any Benzene Coderivative substances with cause leukaemia. 1. Pick an bigger size absorbent cotton than BGA IC with a tweezers and dip into the removing liquid. Then cover it evenly on BGA IC chip which in need of glue removing. 2. Place a plastic bag or film on the top and cover the PCB board.
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