High purity tin solder paste with 158 degree Celsius melting point for lead-free BGA rework. Enhanced wettability formula for stable solder joints and reduced false soldering. Convenient square mouth tub for easy dispensing and minimal waste. Suitable for smartphone motherboard, tablet and PCB repair with hot air stations. Package contains 1 x Mijing High Purity Tin Paste Model 158 (50g).
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