High purity tin solder paste with 183 degree Celsius melting point for standard lead-free BGA rework. Superior wettability formula for strong reliable solder joints and reduced bridging. Convenient square mouth tub for easy dispensing and minimal waste. Suitable for smartphone motherboard, tablet and PCB repair with hot air stations. Package contains 1 x Mijing High Purity Tin Paste Model 183 (50g).
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