HIGH CONDUCTIVITY CLASS – ~14.4 W/m·K thermal paste lowers interface resistance for stable device temperatures. NON-CURING & INSULATING – Remains paste-like for easy rework; electrically insulating for safe use around PCBs. Very low evaporation (≤0.5% at 200 °C, 24 h) supports clean, long-life installs. WIDE OPERATING RANGE – Performs from −50 °C to 280 °C with low thermal impedance (
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