Molevion NanoCool TX 127 Thermal Paste 10 g 12.7 W/m·K Non Curing, Electrically Insulating Compound for CPUs, GPUs, LEDs, VRMs & Power Modules
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HIGH CONDUCTIVITY 12.7 W/m·K – Forms a reliable thermal path to heatsinks, lowering interface resistance and peak temperatures. WIDE APPLICATION RANGE – Ideal for CPUs/GPUs, LED modules, VRMs, MOSFETs/IGBTs, chipsets, regulators and telecom/industrial electronics. NON-CURING & REWORKABLE – Stays paste-like for easy application and service without hardening. ELECTRICALLY INSULATING – Safe around PCBs, drivers and sensor modules in compact assemblies. LOW BLEED / LOW EVAPORATION – Clean operation across heat cycles; helps keep pads and boards free from residue.
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HIGH CONDUCTIVITY 12.7 W/m·K – Forms a reliable thermal path to heatsinks, lowering interface resistance and peak temperatures. WIDE APPLICATION RANGE – Ideal for CPUs/GPUs, LED modules, VRMs, MOSFETs/IGBTs, chipsets, regulators and telecom/industrial electronics. NON-CURING & REWORKABLE – Stays paste-like for easy application and service without hardening. ELECTRICALLY INSULATING – Safe around PCBs, drivers and sensor modules in compact assemblies. LOW BLEED / LOW EVAPORATION – Clean operation across heat cycles; helps keep pads and boards free from residue.
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