Molevion NanoCool SHTC 10 Silicone Heat Transfer Compound 30 g 1.0 W/m·K Thermal Grease, Non-Curing, Electrically Insulating CPUs, LEDs, Power Modules, Sensors
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RELIABLE THERMAL PATH – 1.0 W/m·K conductivity at 25 °C bridges micro-gaps between heat sources and sinks for lower interface resistance. NON-CURING & INSULATING – Stays paste-like for easy rework; electrically insulating with stable chemistry for long service life. WIDE OPERATING WINDOW – Usable from -40 °C to 220 °C; very low volatility and oil separation for consistent performance. SERVICE-FRIENDLY 50 G JAR – Smooth thixotropic spread for TIM application on CPUs, LEDs, drivers, power transistors and sensor modules.
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RELIABLE THERMAL PATH – 1.0 W/m·K conductivity at 25 °C bridges micro-gaps between heat sources and sinks for lower interface resistance. NON-CURING & INSULATING – Stays paste-like for easy rework; electrically insulating with stable chemistry for long service life. WIDE OPERATING WINDOW – Usable from -40 °C to 220 °C; very low volatility and oil separation for consistent performance. SERVICE-FRIENDLY 50 G JAR – Smooth thixotropic spread for TIM application on CPUs, LEDs, drivers, power transistors and sensor modules.
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