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BUILT FOR 3D PRINTERS & ROBOTICS – Optimised for hotend heatsinks, control boards, stepper drivers, MCU/VRMs, servos and motor drivers. HIGH CONDUCTIVITY 12.3 W/m·K – Creates a reliable heat path to heatsinks for lower interface resistance and better temperature stability. NON-CURING, REWORKABLE – Stays paste-like for easy application, teardown and re-assembly during upgrades or maintenance. ELECTRICALLY INSULATING – Safe around PCBs, drivers and sensor modules where electrical isolation is required. LOW BLEED / LOW EVAP – Clean operation over long duty cycles; ideal for enclosed printers, robots and embedded systems.