SEMICONDUCTOR Packaging ENGINEERING: Advanced Chiplets 3D Integration Thermal Management Interconnects Testing and Reliability

Prices from
9.52

Sponsored links

COMPARE ALL WEBSHOPS (2)

Description

SEMICONDUCTOR Packaging ENGINEERING: Advanced Chiplets 3D Integration Thermal Management Interconnects Testing and Reliability

Description Description
Product Specifications Product specifications
Related results Related results
Next
Previous

Compare webshops (2)

Sponsored links · Some shops pay us a fee

Sort by:

£ 9.52

£ 9.52

Description (0)

SEMICONDUCTOR Packaging ENGINEERING: Advanced Chiplets 3D Integration Thermal Management Interconnects Testing and Reliability

Product specifications

Brand Independently Published
EAN
  • 9798194369058

Independently Published

Advanced Semiconductor Packaging Handbook: Chiplets, Heterogeneous Integration, 2.5D/3D Design, Manufacturing, Reliability, and Test

£ 97.25
Compare 2 stores 2 stores

Independently Published

Advanced Semiconductor Packaging Handbook: Chiplets, Heterogeneous Integration, 2.5D/3D Design, Manufacturing, Reliability, and Test

£ 74.80
Compare 2 stores 2 stores

Independently Published

3D IC and 2.5D DESIGN: Architecture, Chiplets, TSVs, Interposers, Advanced Packaging, Thermal...

£ 16.62
Compare 2 stores 2 stores

Springer

Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets Heterogeneous Integration

£ 88.21
Compare 2 stores 2 stores
Featured Choice
£ 9.52
To Shop