Thermal Grizzly Minus Pad Advance 100x100x1.0mm 2 Pack Interface Pad, Electrically Non Conductive, High Conductivity & Compressibility for SSDs, GPUs Electronics

Thermal Grizzly Pad Minus Pad Advance 100x100x1.0 Mm Thermal Paste. With the Thermal Grizzly Minus Pad Advance, the Hamburg-based cooling specialist expands its product range with advanced thermal pads. Based on its predecessor, the Minus Pad 8, they have been further developed to significantly improve thermal conductivity.The Minus Pad Advance is ideal for applications where thermal paste is difficult to apply or where a gap between the heat source and the heat sink needs to be bridged. It is therefore optimal for use with memory chips or voltage converters. It is based on a silicone-containing carrier complex and aluminium oxide as the heat transfer medium, achieving similar thermal conductivity to thermal paste.The Minus Pad is available in various dimensions and thicknesses from 0.5 to 3 millimetres. Since it works optimally even at minimal contact pressure and thermal conductivity is hardly affected by thickness, the choice of thickness should be aligned solely with the distance to be bridged.Specifications: Dimensions: - Length / Depth: 100 mm- Width: 100 mm- Height: 1 mmMaterials: - Materials: Aluminium oxide. tradeinn Techinn

THERMAL PAD FOR GPU, SSD AND COMPONENT COOLING Minus Pad Advance is made for reliable heat transfer between components and coolers. VERY GOOD THERMAL CONDUCTIVITY FOR PC HARDWARE The material supports efficient cooling for VRAM, SSD controllers, chipsets and similar parts. FLEXIBLE PAD MATERIAL FOR EASY INSTALLATION Can compensate contact tolerances and supports clean handling during assembly. AVAILABLE IN PRACTICAL SIZES AND THICKNESSES This variant uses 2x 100x100x0.5 mm for targeted replacement or new cooling setups. NON-CURING AND ELECTRICALLY NON-CONDUCTIVE Designed for long-term stability and safer use on sensitive electronic components.