THERMAL PAD FOR GPU, SSD AND COMPONENT COOLING Minus Pad Advance is made for reliable heat transfer between components and coolers. VERY GOOD THERMAL CONDUCTIVITY FOR PC HARDWARE The material supports efficient cooling for VRAM, SSD controllers, chipsets and similar parts. FLEXIBLE PAD MATERIAL FOR EASY INSTALLATION Can compensate contact tolerances and supports clean handling during assembly. AVAILABLE IN PRACTICAL SIZES AND THICKNESSES This variant uses 2x 100x100x1.5 mm for targeted replacement or new cooling setups. NON-CURING AND ELECTRICALLY NON-CONDUCTIVE Designed for long-term stability and safer use on sensitive electronic components.
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