TR Thermalright AXP90 X47 Full CPU Cooler 4 Heat Pipes, Quiet 92mm Low Profile Fan 2700RPM, for AMD AM4/AM5,Intel LGA1851/1700/115x/1200,Low ITX PC Pure Copper Process
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Description
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ITX Downward Cooling - 4 x 6mm diameter antioxidant pure copper heat pipes directly touch the CPU and quickly export heat, with a size of 94.5x95x47mm, suitable for small ITX chassis to avoid conflicts with memory/graphics cards Silent design - 92mm thin fan (2700RPM±10%), 42.58 CFM airflow, 22.4 dBA fan noise, balanced heat dissipation and noise, S-FDB V2 bearing technology, reduce friction vibration, and extend fan life Pure copper process - 47mm heat dissipation height, compatible with ITX motherboard, 2 welding heat pipe fin process and pure copper oxidation process, double the heat conduction efficiency Compatibility - Support Intel LGA1851/1700/1150/1151/1155/1156/1200, AMD AM4/AM5, all-platform common backplane, standard hand-screw nut socket, easy installation. AGHP Heat Pipe Technology - cpu cooler's anti-gravity heat pipe technology solves the problem of low performance caused by gravity and optimizes the cooling performance of the CPU heatsink in the vertical direction of the motherboard
ITX Downward Cooling - 4 x 6mm diameter antioxidant pure copper heat pipes directly touch the CPU and quickly export heat, with a size of 94.5x95x47mm, suitable for small ITX chassis to avoid conflicts with memory/graphics cards Silent design - 92mm thin fan (2700RPM±10%), 42.58 CFM airflow, 22.4 dBA fan noise, balanced heat dissipation and noise, S-FDB V2 bearing technology, reduce friction vibration, and extend fan life Pure copper process - 47mm heat dissipation height, compatible with ITX motherboard, 2 welding heat pipe fin process and pure copper oxidation process, double the heat conduction efficiency Compatibility - Support Intel LGA1851/1700/1150/1151/1155/1156/1200, AMD AM4/AM5, all-platform common backplane, standard hand-screw nut socket, easy installation. AGHP Heat Pipe Technology - cpu cooler's anti-gravity heat pipe technology solves the problem of low performance caused by gravity and optimizes the cooling performance of the CPU heatsink in the vertical direction of the motherboard