TR Thermalright AXP90 X53 Full CPU Cooler 4 Heat Pipes, Quiet 92mm Low Profile Fan 2700RPM, for AMD AM4/AM5,Intel LGA1851/1700/115x/1200,Low ITX PC Pure Copper Process
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Description
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ITX Downward Cooling - 4 x 6mm diameter antioxidant pure copper heat pipes directly touch the CPU and quickly export heat, with a size of 94.5x95x53mm, suitable for small ITX chassis to avoid conflicts with memory/graphics cards Silent design - 92mm thin fan(2700RPM±10%), 42.58 CFM airflow, 22.4 dBA fan noise, balanced heat dissipation and noise, S-FDB V2 bearing technology, solve the fan blade shake problem in lifting mode, and extend the fan life. Grasp the details - 53mm heat dissipation height, compatible with ITX motherboards, 2 times welding heat pipe fin process, heat conduction efficiency is doubled. Compatibility - Support Intel LGA 1851/1700/1150/1151/1155/1156/1200, AMD AM4/AM5, all-platform common backplane, standard hand-screw nut socket, easy installation. Pure copper process - 53mm heat dissipation height, compatible with ITX motherboard, 2 welding heat pipe fin process and pure copper oxidation process, double the heat conduction efficiency
ITX Downward Cooling - 4 x 6mm diameter antioxidant pure copper heat pipes directly touch the CPU and quickly export heat, with a size of 94.5x95x53mm, suitable for small ITX chassis to avoid conflicts with memory/graphics cards Silent design - 92mm thin fan(2700RPM±10%), 42.58 CFM airflow, 22.4 dBA fan noise, balanced heat dissipation and noise, S-FDB V2 bearing technology, solve the fan blade shake problem in lifting mode, and extend the fan life. Grasp the details - 53mm heat dissipation height, compatible with ITX motherboards, 2 times welding heat pipe fin process, heat conduction efficiency is doubled. Compatibility - Support Intel LGA 1851/1700/1150/1151/1155/1156/1200, AMD AM4/AM5, all-platform common backplane, standard hand-screw nut socket, easy installation. Pure copper process - 53mm heat dissipation height, compatible with ITX motherboard, 2 welding heat pipe fin process and pure copper oxidation process, double the heat conduction efficiency