AABCOOLING Thermal Grease 3 1g Compound for Heat Dissipation From CPU, Heatsink Paste, Processor CPU Cooling Paste 8.5 W/mK

✅ The most efficient thermal compound with a conductivity of up to 8.5 W / mK, designed to provide the most stable operation ✅ The modern formula of TG3 heatsink paste does not conduct electricity, so there is not even the slightest risk of electrical fault ✅ High quality of the cooling paste ensures stable operation without compromising thermal performance ✅ Processor paste application: Systems used in PCs, laptops and other electronics: CPUs (between the heat sink and the CPU), graphics cards (between the heat sink and the GPU), chipsets (between the heat sink and North Bridge and South Bridge), power sections and among other heating circuits in widely used electronics ✅ CPU paste package (net): 1g