AABCOOLING Thermal Grease 4 1g Paste for Heat Dissipation From CPU, CPU Paste, Kit, Heatsink Compound, Processor 9.5 W/mK

✅ Thermal pastes performance at the highest level of 9,5 W / mK ✅ The modern CPU paste formula was developed using Carbon-Nano technology, which incorporates a unique composition of metal oxide compounds that is six times better conductive than copper ✅ Processor paste application: Systems used in PCs, laptops and other electronics: CPUs (between the heat sink and the CPU), graphics cards (between the heat sink and the GPU), chipsets (between the heat sink and North Bridge and South Bridge), power sections and among other heating circuits in widely used electronics ✅ The ultra-modern formula of the TG4 thermal paste kit does not conduct electricity, so there is not even the slightest risk of electrical fault ✅ Heatsink compound package (net): 1 g